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Kai Cui

Short name: K. Cui

kaicui@qti.qualcomm.com Qualcomm 15 document(s)
Affiliations
Qualcomm 2022-10-20 - 2026-01-23
Known Emails
Documents
JVET-AO0220
41st Meeting: by teleconference, CH, January 2026 2026-01-08 03:13
AHG12: Optimizations for JVET-AN0271 software

Y.-J. Chang, C.-C. Chen, M. Coban, K. Cui, P. Garus, N. Hu, M. Karczewicz, P.-H. Lin, X. Meng, V. Menon, V. Seregin, Y. Shao, G. Verba, H. Wang, E. Ye, R. Yu, Y. Zhang, Z. Zhang, W. Zhu (Qualcomm)

JVET-AN0271
40th Meeting: Geneva, CH, October 2025 2025-10-07 19:18
Software optimization and complexity reduction of ECM

Y.-J. Chang, C.-C. Chen, M. Coban, K. Cui, P. Garus, N. Hu, M. Karczewicz, P.-H. Lin, X. Meng, B. Ray, V. Seregin, Y. Shao, G. Verba, H. Wang, E. Ye, R. Yu, Y. Zhang, Z. Zhang, W. Zhu (Qualcomm)

JVET-AN0085
40th Meeting: Geneva, CH, October 2025 2025-10-03 11:18
Response to the joint CfE on video compression with capability beyond VVC

M. Abdoli, P. Nikitin, F. Plowman, A. Tissier, R. G. Youvalari, M.-L. Champel (Xiaomi), Y.-J. Chang, C.-C. Chen, M. Coban, K. Cui, P. Garus, N. Hu, M. Karczewicz, J.-L. Lin, P.-H. Lin, X. Meng, B. Ray, V. Seregin, Y. Shao, G. Verba, H. Wang, E. Ye, R. Yu, Y. Zhang, Z. Zhang, W. Zhu (Qualcomm), F. Le Léannec, K. Naser (InterDigital), F. Wang (OPPO), Y. Kidani, H. Kato, T. Chujoh, K. Kawamura (KDDI), Z. Deng, K. Zhang, L. Zhang (Bytedance), A. Filippov, J. Konieczny, V. Rufitskiy, H. Qin, T. Dong, Z. Xu, K. Ding, C. Hollmann, I. Zupancic, D. Li (TCL), X. Xiu, X. Wang (Kwai)

JVET-AJ0321
36th Meeting: Kemer, TR, November 2024 2024-11-05 09:42
AHG12: ECM complexity trade-offs

Y.-J. Chang, C.-C. Chen, M. Coban, K. Cui, P. Garus, N. Hu, H. Huang, M. Karczewicz, J.-L. Lin, P.-H. Lin, P. Nikitin, B. Ray, V. Seregin, G. Verba, H. Wang, E. Ye, R. Yu, Y. Zhang, Z. Zhang (Qualcomm)

JVET-AI0323
35th Meeting: Sapporo, JP, July 2024 2024-07-15 12:37
Crosscheck of JVET-AI0096 (AHG12: Fixes for Adaptive Clipping and Sign Prediction)

H. Wang, K. Cui (Qualcomm)

JVET-AI0185
35th Meeting: Sapporo, JP, July 2024 2024-07-05 20:38
EE2-3.6: Adaptive cost function selection in merge mode

K. Cui, Z. Zhang, Y. Zhang, H. Huang, V. Seregin, M. Karczewicz (Qualcomm)

JVET-AH0215
34th Meeting: Rennes, FR, April 2024 2024-04-19 09:16
Non-EE2: Adaptive Cost Function Selection in Merge Mode

K. Cui, Z. Zhang, Y. Zhang, H. Huang, V. Seregin, M. Karczewicz (Qualcomm)

JVET-AG0171
33rd Meeting: by teleconference, CH, January 2024 2024-01-16 22:32
Crosscheck of JVET-AG0136 (EE2-1.5: IntraTMP extension to LIC)

K. Cui (Qualcomm)

JVET-AG0170
33rd Meeting: by teleconference, CH, January 2024 2024-01-16 22:30
Crosscheck of JVET-AG0146 (EE2-1.4: IntraTMP extension to DIMD)

K. Cui (Qualcomm)

JVET-AG0145
33rd Meeting: by teleconference, CH, January 2024 2024-01-10 20:14
EE2-4.1: Adaptive clipping with signalled lower and upper bounds

K. Cui, Z. Zhang, H. Huang, V. Seregin, M. Karczewicz (Qualcomm)

JVET-AF0169
32nd Meeting: Hannover, DE, October 2023 2023-10-15 09:11
Non-EE2: Adaptive clipping with signaled lower and upper bounds

K. Cui, Z. Zhang, H. Huang, V. Seregin, M. Karczewicz (Qualcomm)

JVET-AD0193
30th Meeting: Antalya, TR, April 2023 2023-04-20 08:54
EE2-2.11e: Adaptive OBMC control

K. Cui, Z. Zhang, H. Huang, V. Seregin, M. Karczewicz (Qualcomm), X. Li (Google), Z. Deng, K. Zhang, L. Zhang (Bytedance)

JVET-AC0335
29th Meeting: by teleconference, DE, January 2023 2023-01-17 16:48
Non-EE2: Content adaptive OBMC enabling

K. Cui, Z. Zhang, V. Seregin, M. Karczewicz (Qualcomm)

JVET-AC0150
29th Meeting: by teleconference, DE, January 2023 2023-01-11 11:57
EE2-2.6: ARMC merge candidate list reordering for AMVP-merge mode

K. Cui, C. S. Coban, Z. Zhang, H. Huang, V. Seregin, M. Karczewicz (Qualcomm), H. Jang (LGE)

JVET-AB0151
28th Meeting: Mainz, DE, October 2022 2022-10-22 09:13
EE2-2.1 related: ARMC merge candidate list reordering for AMVP-merge mode for low-delay pictures

K. Cui, C. S. Coban, Z. Zhang, V. Seregin, H. Huang, M. Karczewicz (Qualcomm), H. Jang (LGE)