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JVET-AI0143
35th Meeting: Sapporo, JP, July 2024 2024-07-17 08:18
EE2-2.4d: Combination of EE2 tests 2.1, 2.2 and 2.4a

D. Bugdayci Sansli, S. Blasi, J. Lainema (Nokia), K. Naser, Y. Chen, F. Le Léannec, M. Radosavljević, K. Reuze (InterDigital), J. Fu, J. Zhang, S. Ma (PKU), Y. Gao, C. Huang (ZTE), M. Abdoli, R. G. Youvalari, A. Tissier (Xiaomi), Y.-J. Chang, V. Seregin, M. Karczewicz (Qualcomm)

JVET-AI0171
35th Meeting: Sapporo, JP, July 2024 2024-07-16 10:01
EE2-2.3: Combination of EE2-2.1/EE-2-2.5a and EE2-2.2

M. Abdoli, R. G. Youvalari, A. Tissier (Xiaomi), K. Naser, Y. Chen, F. Le Léannec, M. Radosavljević, K. Reuze (InterDigital), Y-J. Chang, V. Seregin, M. Karczewicz (Qualcomm), J. Fu, Z. Li, J. Zhang, C. Jia, S. Ma (PKU), Y. Gao, C. Huang (ZTE)

JVET-AI0141
35th Meeting: Sapporo, JP, July 2024 2024-07-13 05:04
EE2-2.4c: Combination of EE2 tests 2.2 and 2.4a

D. Bugdayci Sansli, S. Blasi, J. Lainema (Nokia), K. Naser, Y. Chen, F. Le Léannec, M. Radosavljević, K. Reuze (InterDigital), J. Fu, J. Zhang, S. Ma (PKU), Y. Gao, C. Huang (ZTE)

JVET-AF0118
32nd Meeting: Hannover, DE, October 2023 2023-10-14 08:13
Non-EE2: Regression-based GPM blending

P. Bordes, F. Galpin, K. Naser, F. Urban, K. Reuze, F. Le Leannec, E. Francois (InterDigital)

JVET-AF0130
32nd Meeting: Hannover, DE, October 2023 2023-10-13 01:53
EE2-2.4: IntraCIIP as additional mode of IntraTMP

K. Naser, P. Bordes, F. Galpin, K. Reuze (InterDigital)

JVET-AE0214
31st Meeting: Geneva, CH, July 2023 2023-07-16 14:40
AHG12: on Intra CIIP

K. Naser, P. Bordes, F. Galpin, K. Reuze (InterDigital)

JVET-AD0179
30th Meeting: Antalya, TR, April 2023 2023-04-22 17:22
[AHG12] Extending TIMD with IntraTMP

K. Naser, P. Bordes, K. Reuze, F. Galpin (InterDigital)

JVET-AD0119
30th Meeting: Antalya, TR, April 2023 2023-04-21 03:18
EE2-1.20m: Combination test of Test 1.17 and Test 1.18

Y. Wang, K. Zhang, L. Zhang (Bytedance), K. Naser, P. Bordes, F. Galpin, K. Reuze, A. Robert (InterDigital)

JVET-AC0201
29th Meeting: by teleconference, DE, January 2023 2023-01-16 23:21
AHG12: CIIP extension with Intra Template Matching

K. Naser, P. Bordes, F. Galpin, K. Reuze, A. Robert (InterDigital)

JVET-AC0101
29th Meeting: by teleconference, DE, January 2023 2023-01-04 15:36
EE2-1.11b: Combination of Test 1.8, Test 1.9 and Test 1.10

S. Blasi, J. Lainema (Nokia), T. Dumas, K. Reuze (InterDigital)

JVET-AA0045
27th Meeting: by teleconference, July 2022 2022-07-14 09:45
[EE2-1.4 related] Reduced Complexity Spatial GPM

K. Naser, Y. Chen, A. Robert, K. Reuze (InterDigital)

JVET-Y0111
25th Meeting: by teleconference, January 2022 2022-01-12 17:35
AhG11: Hybrid Conventional/Deep-learning-based image coding

F. Galpin, T. Dumas, P. Bordes, F. Racapé, E. François (InterDigital), Y. Li, Kai Zhang, Li Zhang (Bytedance), H. Wang, K. Reuze, A.M. Kotra, M. Karczewicz (Qualcomm),

JVET-Y0143
25th Meeting: by teleconference, January 2022 2022-01-12 00:55
EE1-1.2: Test on Deep In-Loop Filter with Adaptive Parameter Selection and Residual Scaling

Y. Li, K. Zhang, L. Zhang (Bytedance), H. Wang, K. Reuze, A.M. Kotra, M. Karczewicz (Qualcomm)

JVET-X0066
25th Meeting: by teleconference, October 2021 2021-10-06 15:10
EE1-1.6: Combined Test of EE1-1.2 and EE1-1.4

Y. Li, K. Zhang, L. Zhang (Bytedance), H. Wang, J. Chen, K. Reuze, A.M. Kotra, M. Karczewicz (Qualcomm)

JVET-X0140
25th Meeting: by teleconference, October 2021 2021-09-30 23:29
EE1-1.4: Tests on Neural Network-based In-Loop Filter with Constrained Computational Complexity

H. Wang, J. Chen, K. Reuze, A.M. Kotra, M. Karczewicz (Qualcomm)

JVET-W0131
23rd Meeting: by teleconference, July 2021 2021-07-08 06:36
EE1-related: Neural Network-based in-loop filter with constrained computational complexity

H. Wang, J. Chen, K. Reuze, A.M. Kotra, M. Karczewicz (Qualcomm)

JVET-W0130
23rd Meeting: by teleconference, July 2021 2021-07-01 11:04
EE1-1.4: Test on Neural Network-based In-Loop Filter with Large Activation Layer

H. Wang, J. Chen, K. Reuze, A.M. Kotra, M. Karczewicz (Qualcomm)

JVET-U0100
21st Meeting: by teleconference, January 2021 2021-01-12 07:32
Compression efficiency methods beyond VVC

Y.-J. Chang, C.-C. Chen, J. Chen, J. Dong, H. E. Egilmez, N. Hu, H. Huang, M. Karczewicz, J. Li, B. Ray, K. Reuze, V. Seregin, N. Shlyakhov, L. Pham Van, H. Wang, Y. Zhang, Z. Zhang (Qualcomm)

JVET-Q0297
17th Meeting: Brussels, January 2020 2020-01-15 23:37
AHG16: Merge estimation region with constraint in HMVP update

H. Huang, W.-J. Chien, T. Hsieh, V. Seregin, C.-C. Chen, K. Reuze, M. Karczewicz (Qualcomm), Y.-L. Hsiao, C.-C. Chen, C.-W. Hsu, T.-D. Chuang, C.-Y. Chen, Y.-W. Huang, S.-M. Lei (MediaTek)

JVET-Q0062
17th Meeting: Brussels, January 2020 2020-01-14 22:40
CE4-3: Constrain SBT for GEO mode

H. Huang, T. Hsieh, V. Seregin, K. Reuze, C.-C. Chen, H.E. Egilmez, W.-J. Chien, M. Karczewicz (Qualcomm), L. Xu, X. Cao, Y. Sun, F. Chen, L. Wang (Hikvision)

JVET-Q0185
17th Meeting: Brussels, January 2020 2020-01-12 21:15
AHG16: On merge estimation region for VVC

Y.-L. Hsiao, C.-C. Chen, C.-W. Hsu, T.-D. Chuang, C.-Y. Chen, Y.-W. Huang, S.-M. Lei (MediaTek), H. Huang, W.-J. Chien, T. Hsieh, V. Seregin, C.-C. Chen, K. Reuze, M. Karczewicz (Qualcomm)

JVET-Q0079
17th Meeting: Brussels, January 2020 2020-01-08 15:39
CE4 Common Base: Geometric inter prediction

H. Gao, S. Esenlik, E. Alshina, A. M. Kotra, B. Wang (Huawei), K. Reuze, C.-C. Chen, H. Huang, W.-J. Chien, V. Seregin, M. Karczewicz (Qualcomm), R.-L. Liao, J. Chen, Y. Ye, J. Luo (Alibaba), M. Blaser, J. Sauer (RWTH Aachen)

JVET-P1023
16th Meeting: Geneva, October 2019 2019-10-09 17:11
Joint solution for the reference picture conditions in DMVR and BDOF (JVET-P0089, JVET-P0191, JVET-P0311, JVET-P0415, JVET-P0546, JVET-P0598)

H. Huang, C.-C. Chen, K. Reuze, W.-J. Chien, M. Karczewicz (Qualcomm), N. Zhang, H. Liu, L. Zhang, K. Zhang, Y. Wang (Bytedance), W. Chen, Y. He (InterDigital), K. Unno, K. Kawamura, S. Naito (KDDI), F. Chen, L. Wang (Hikvision)

JVET-P0583
16th Meeting: Geneva, October 2019 2019-09-30 20:07
CE4-related: On the SBT in CE4-1.1

H. Huang, T. Hsieh, V. Seregin, K. Reuze, C.-C. Chen, H.E. Egilmez, W.-J. Chien, M. Karczewicz (Qualcomm)

JVET-O1172
15th Meeting: Gothenburg, SE, July 2019 2019-07-11 09:40
Non-CE4/8: On disabling blending process in TPM

C.-C. Chen, K. Reuze, W.-J. Chien, M. Karczewicz (Qualcomm), W. Zhu, L. Zhang, J. Xu, K. Zhang (Bytedance), M. Bläser, J. Sauer (RWTH Aachen University),

JVET-O0646
15th Meeting: Gothenburg, SE, July 2019 2019-07-05 17:14
Non-CE4/8: Combination of Blending-off Switch (JVET-O0645) and Simplified Motion Storage (JVET-O0411) for TPM Mode

C.-C. Chen, K. Reuze, Y. Zhang, W.-J. Chien, M. Karczewicz (Qualcomm)

JVET-O0645
15th Meeting: Gothenburg, SE, July 2019 2019-07-02 09:24
Non-CE4/8: Blending-off Switch for TPM Mode

C.-C. Chen, Y. Zhang, K. Reuze, Y.-J. Chang, W.-J. Chien, M. Karczewicz (Qualcomm)

JVET-N0482
14th Meeting: Geneva, March 2019 2019-03-21 12:48
CE1-related: Additional test results for CE1-7 tests

D. Rusanovskyy, K. Reuze, M. Karczewicz

JVET-N0785
14th Meeting: Geneva, March 2019 2019-03-21 12:46
Cross-check of JVET-N0493: CE1-related: Multiplication-free bilateral loop filter, with additional tests on RDO

K. Reuze, D. Rusanovskyy

JVET-N0489
14th Meeting: Geneva, March 2019 2019-03-18 21:33
CE1: Bilateral filter tests

J. Ström, P. Wennersten, J. Enhorn (Ericsson), K. Reuze, D. Rusanovskyy, M. Karczewicz (Qualcomm)