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19th Meeting: by teleconference, June 2020 2020-06-11 01:46
AHG9: On picture bumping process
Authors: Vadim Seregin Qualcomm Yong He Qualcomm Muhammed Coban Qualcomm Marta Karczewicz Qualcomm
Abstract
In VVC, there is a bumping process applied to pictures in AU, it is asserted that bumping is not applied to CVSS AU 0. It also asserted that in the “Additional bumping” process last DU description is ambiguous.
Meeting Notes
JVET-S0223 AHG9: On picture bumping process [V. Seregin, Y. He, M. Coban, M. Karczewicz (Qualcomm)]
References:
JVET-S0152
Cited:
JVET-AA0003 JVET-AQ0003 JVET-S0141 JVET-V0003 JVET-W0003 JVET-X0003 JVET-Y0003 JVET-Z0003
PATENTS:
20210385472 1.00 WO/2021/252293 1.00 3162708 1.00 WO/2021/133788 1.00 20210195175 0.34 20200404300 0.30 3987777 0.28 WO/2020/257468 0.26
ARCHIVE v1 :
JVET-S0223.docx
Decisions
JVET-S0223 AHG9: On picture bumping process [V. Seregin, Y. He, M. Coban, M. Karczewicz (Qualcomm)]
Citation